ArticleSensors (Basel, Switzerland)2019
Microstrip Patch Strain Sensor Miniaturization Using Sierpinski Curve Fractal Geometry.
Article in Sensors (Basel, Switzerland), 2019. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 6 papers.
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6 citing papers in PubMed.
- High-Concentration Gold Nanoparticle Pastes for Advanced Deposition-Based Sensor Manufacturing.Sensors (Basel, Switzerland) · 2026Article
- Wearable Sensor Based on Flexible Sinusoidal Antenna for Strain Sensing Applications.Sensors (Basel, Switzerland) · 2022Article
- Application of a Single Cell Electric-SRR Metamaterial for Strain Evaluation.Materials (Basel, Switzerland) · 2021Article
- Design of Dielectric Resonator Antenna Using Dielectric Paste.Sensors (Basel, Switzerland) · 2021Article
- Sensors for Structural Health Monitoring and Condition Monitoring.Sensors (Basel, Switzerland) · 2021Article
- An Hourglass-Shaped Wireless and Passive Magnetoelastic Sensor with an Improved Frequency Sensitivity for Remote Strain Measurements.Sensors (Basel, Switzerland) · 2020Article
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Authors and funding
2 authors.
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Abstract
In this paper miniaturization of a microstrip patch strain sensor (MPSS) using fractal geometry was proposed and analyzed. For this purpose, the transducer of Sierpinski curve geometry was utilized and compared with the most commonly utilized rectangular resonator-based one. Both sensors were designed for the same resonant frequency value (2.725 GHz). This fact allows analysis of the influence of the patch (resonator) shape and size on the resonant frequency shift. This is very important as the sensors with the same resonator shape but designed on various operating frequencies have various resonant frequency shifts. Simulation and experimental analysis for all sensors were carried out. A good convergence between results of simulation and measurements was achieved. The obtained results proved the possibility of microstrip strain sensor dimensions reduction using Sierpinski curve fractal geometry. Additionally, an influence of microstrip line deformation for proposed sensors was studied.
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