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ArticleNano-micro letters2025

A Hierarchical Short Microneedle-Cupping Dual-Amplified Patch Enables Accelerated, Uniform, Pain-Free Transdermal Delivery of Extracellular Vesicles.

Minwoo Song et al.PubMed ↗Full text ↗Publisher ↗

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2026
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Full record →Abstract, authors, funding and every citing paper · PMID 40699546