ArticleNanomaterials (Basel, Switzerland)2025
Reactive Magnetron-Sputtered Tantalum-Copper Nitride Coatings: Structure, Electrical Anisotropy, and Antibacterial Behavior.
Article in Nanomaterials (Basel, Switzerland), 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
Tantalum nitride (TaN) coatings are valued for their hardness, chemical inertness, and biocompatibility; however, they lack intrinsic antibacterial properties, which limits their application in biomedical environments. Introducing copper (Cu) into the TaN matrix offers a potential solution by combining TaN's mechanical and chemical durability with Cu's well-documented antimicrobial action. This study explores how varying copper incorporation affects the structural, electrical, photocatalytic, and antibacterial characteristics of TaCuN multilayer films synthesized via reactive magnetron sputtering. Three thin TaCuN films were fabricated using a high-power reactive magnetron co-sputtering system, varying the Cu target power to control the composition. Structural and morphological analysis was performed using X-ray diffraction (XRD), scanning/transmission electron microscopy (STEM/TEM), and energy-dispersive X-ray spectroscopy (EDS). Electrical conductivity was studied along and across the film surfaces at temperatures ranging from 20 to 375 K using AC impedance spectroscopy. Optical and photocatalytic properties were assessed using UV-Vis spectroscopy and methylene blue degradation tests. Antibacterial activity against Staphylococcus aureus was analyzed under visible light using CFU reduction tests. XRD and TEM analyses revealed a multilayered four-zone architecture with alternating Ta-, Cu-, and N-rich phases and a dominant cubic δ-TaN pattern. The layers exhibited pronounced conductivity anisotropy, with in-plane conductivity (~10
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